Determination of Effective Critical Breakdown Field in 4H-SiC Superjunction Devices

Avalanche Multiplication and Breakdown in 4H-SiC Diodes

The measured photomultiplication and excess noise characteristics of two 4H-SiC p-i-n diodes, with i-region widths of 0.105 μm and 0.285 μm, were modelled using a nonlocal multiplication model to determine the ionization threshold energies and the impact ionization coefficients of 4H-SiC. The modelled ionization coefficients accurately predicted the breakdown voltage of a 0.485 μm p-i-n structu...

Characterization of Dielectric Layers for Passivation of 4H-SiC Devices

Characterization of Large Area 4H-SiC and 6H-SiC Capacitive Devices

SiC based capacitive devices have the potential to operate in high temperature, chemically corrosive environments provided that the electrical integrity of the gate oxide and metallization can be maintained in these environments. We report on the performance of large area, up to 8 x 10 -3 cm, field-effect capacitive sensors fabricated on both the 4H and 6H polytypes at 600°C. Large area capacit...

BREAKDOWN DEGRADATION ASSOCIATED WITH ELEMENTARY SCREW DISLOCATIONS IN 4H-SiC PN JUNCTION RECTIFIERS

It is well-known that SiC wafer quality deficiencies are delaying the realization of outstandingly superior 4H-SiC power electronics. While efforts to date have centered on eradicating micropipes (i.e., hollow core super-screw dislocations with Burgers vector > 2c), 4H-SiC wafers and epilayers also contain elementary screw dislocations (i.e., Burgers vector = 1c with no hollow core) in densitie...

Annealing of multivacancy defects in 4H-SiC

The annealing behavior of defects observed in electron paramagnetic resonance EPR and photoluminescence PL is discussed. We consider the divacancy the P6/P7 EPR centers and a previously unreported EPR center that we suggest is a VC-VSi-VC trivacancy and their relationship with each other and with the UD1–3 series of PL lines near 1 eV. We observe that the divacancy and the UD2 PL lines annealin...